Intel reveals skinny Ivy Bridge 'Ultrabooks,' Moore's Law-defying Atoms

Intel took the opportunity at Computex to update the tech-loving world on its processor plans, and it looks like those whispers we heard about low power and an accelerated Atom roadmap were spot on. Executive VP Sean Maloney didn’t divulge specific TDPs but did confirm that we could look forward to reduced power consumption and sleek designs in 2012. The Intel exec declared that new class of PC, dubbed “Ultrabooks,” will make up 40-percent of the market by the end of 2012. These machines, powered by the 22nm Ivy Bridge, will be less than 0.8-inches thick and start at under $1,000 — which sounds just like the lines we were fed about CULV chips back in 2009.

Maloney also confirmed that, going forward, the Atom line would be getting a die shrink every year, as opposed to every two. The upcoming, 32nm Cedar Trail will usher in the new Moore’s Law-smashing era with promises of a 10 hour battery life and weeks of standby, and will be succeeded by 22nm and 14nm models. Intel even talked up Medfield, it’s Atom variant designed specifically for smartphones and tablets, and showed off more than 10 tablets based on the Oak Trail-flavored Z670. With AMD merely a fading blip in the company’s rearview mirror it looks like Chipzilla is gunning for all those ARM-touting manufacturers.

Intel's Ivy Bridge coming Q1 2012, growing festive moss while you wait

If you were religiously awaiting the fruition of last month’s Intel leak, brace yourself: we’ve got another one. Although Intel’s updated roadmap hasn’t changed anything per se, it does offer a few specifics. Whereas the previous schedule only suggested we’d be crossing the Ivy Bridge in the first half of 2012, the new roadmap shows the 22 nanometer processor penned in at the end of the first quarter. The Sandy Bridge E series is still on schedule for Q4 however, so unless you just have to have native USB 3.0 and DirectX 11 support, you still have plenty to look forward to. Otherwise, we’ll see you in April.

Intel will mass produce 3D transistors for all future CPUs, starting with 22nm Ivy Bridge (video)

Looks like 3D isn’t just a fad, folks, so long as we’re talking about silicon — Intel just announced that it has invented a 3D “Tri-Gate” transistor that will allow the company to keep shrinking chips, Moore’s Law naysayers be darned. Intel says the transistors will use 50 percent less power, conduct more current and provide 37 percent more speed than their 2D counterparts thanks to vertical fins of silicon substrate that stick up through the other layers, and that those fancy fins could make for cheaper chips too — currently, though, the tri-gate tech adds an estimated 2 to 3 percent cost to existing silicon wafers. Intel says we’ll see the new technology first in its 22nm Ivy Bridge CPUs, going into mass production in the second half of the year, and it’s planning 14nm chips in 2013 and 10nm chips in 2015. Also, 3D transistors won’t be limited to the cutting edge — Intel reps told journalists that they “will extend across the entire range of our product line,” including mobile devices. Three videos and a press release await you after the break.